A foreign media report said President Lee Jae-myung stated that investment of about 40 trillion won in advanced equipment would follow Samsung Electronics' investment in its Asan high-bandwidth memory (HBM) chip packaging plant.
According to a report on the 12th (local time) by Singapore news channel CNA (Channel NewsAsia), the president commented that day on Samsung Electronics' investment in its Asan HBM chip packaging plant. Samsung Electronics is investing 6 trillion won in the plant. The outlet reported that the president said about 40 trillion won would be invested in advanced equipment following this investment.
The outlet converted 6 trillion won to $4.48 billion. It said the exchange rate applied was 1,339.55 won per dollar.
In its headline, the outlet said the expansion of the packaging facility would lead to $30 billion in additional investment.
The article was written by Reuters from Seoul. The same article was also carried on Yahoo Finance. The report did not include details such as Samsung Electronics' position or the investment schedule.
※ This article was written citing an 11/12 (local time) report by Singapore's CNA (Channel NewsAsia).